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BGA Re-ball System
VT-860AL is a fully automatic ball planting line that integrates automatic feeding, tin removal, cleaning, drying, printing solder paste/lux, inspection, ball planting, ball filling, and welding
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BGA Ball Placement System
VT-860 series is a fully automatic BGA Ball Placement System, suitable for BGA, WLCSP, PoP and other types of BGA devices.
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BGA Rework System
VT-360LII series is a rework machine with modular design and full hot air heating method for automatic alignment and placement with high precision, high flexibility and other characteristics, suitable for repair of BGA, PTH, WLCSP, module and other device
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BGA Rework System
VT-360MII is a semi-automatic alignment and placement rework machine with modular design, suitable for servers, Netcom and other PCBA substrates.Repair of BGA, PTH, WLCSP, modules and other devices.

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High Precision BGA Grinding System
VT-630 is a fully automatic chip grinding and PCBA pad deglue equipment, which is suitable for the grinding and degumming process of various dispensing chips such as BGA, WLCSP, and PoP.
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BGA Paste Printer
VT-760ML automatic BGA printing press is a high-precision and high-flexibility machine suitable for BGA ball mounting process
solder paste/flux paste printing.
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BGA De-soldering System
VT-660L BGA Desoldering Rework System is a non-contact removal of residual solder on BGA PAD, suitable for BGA, CSP, WLCSP, QFN, PoP and other chips
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BGA Lead Free Reflow Oven
The VT-960 series is a nitrogen back soldering furnace mainly used for hot air heating and supplemented by thermal radiation, suitable for soldering after planting various types of BGA balls.

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PCBA Desoldering Glue Removal
VT-620II is a high-precision, high-flexibility machine suitable for removing glue/desoldering from PCBA substrate BGA, shielding frame, PTH through-hole PAD.
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PTH Rework System
VT-128 series through-hole component rework system is a rework equipment suitable for the removal and soldering of PTH through-hole components on PCBA substrates.
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SMD Laser Rework System
The SMD laser repair system VT-360LSL is a fully automatic repair equipment that integrates automatic removal, tin removal, soldering/lux, mounting, and laser welding. It is suitable for repairing chip resistors/capacitors, CSP, QFN, and other devices.
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Hot Air Desoldering System
The VT-300LW series of high heat capacity and precise temperature control preheating system is suitable for the rework of SMD, BGA\QFN devices on PCBA substrates such as servers and network communications.

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